- News
15 August 2011
MagnaChip ramps Peregrine’s STeP5 UltraCMOS RF switches to mass production
UltraCMOS technology uses a sapphire substrate, enabling high levels of monolithic integration which results in smaller die, higher yields and fewer external components compared with compound semiconductor processes such as gallium arsenide, Peregrine claims.
Peregrine and MagnaChip have been engaged in the transfer of the patented UltraCMOS technology since mid-2007 and have implemented Peregrine’s STeP3 and STeP4 process generations at MagnaChip's 0.35µm manufacturing facility in Cheongju, South Korea. MagnaChip has now completed the final qualification phase in the transfer of STeP5 process generation and has ramped to high-volume production.
“The continued introduction of these robust and unique RFIC solutions is a direct result of the combined expertise – MagnaChip’s manufacturing services and Peregrine’s technology and design engineering – and of the long-term strategic roadmap we have outlined,” comments TJ Lee, senior VP & general manager of MagnaChip’s corporate and SMS engineering.