News

1 June 2010

 

OIPT launches the PlasmaPro NGP80, the first in a new range of etch, deposition and growth systems

UK-based etch and deposition equipment maker Oxford Instruments Plasma Technology (OIPT), a subsidiary of Oxford Instruments plc, has launched its PlasmaPro NGP80 system.

Picture: OIPT's PlasmaPro NGP80 system.

An open-loading tool, PlasmaPro NGP80 offers versatile plasma etch and deposition solutions on one platform. Its small footprint is easy to site and easy to use, with no compromise on process quality, and with multiple process technology configurations, says the firm.

OIPT’s PlasmaPro NGP80 is suited to R&D or small-scale production, and can process from the smallest wafer pieces to 200mm wafers. The open load design allows fast wafer loading and unloading. Other features include: the latest generation BUS control system (increasing data retrieval and delivering faster and more repeatable matching), and easy access to key components for improved servicing and maintenance.

The PlasmaPro NGP80 offers multiple configurations: RIE, PECVD, ICP & RIE/PE. Applications include: III-V etch processes, Silicon Bosch and cryo-etch processes, Diamond Like Carbon (DLC) deposition, SiO2 and quartz etch, hard mask deposition and etch for high brightness LED production.

OIPT says that the Nanoscale Physics Research Laboratory at Birmingham university has been trialling the PlasmaPro NGP80 for over a year, using the tool to research and develop photo-resists for next generation lithography, and the fabrication of high aspect ratio silicon based field emitters.

"The PlasmaPro NGP80 has significantly enhanced our etching capabilities. The new software is very simple to learn, but allows considerable flexibility to build complex processes. Excellent repeatability together with comprehensive parameter logging have enabled a rapid transfer of previously developed fabrication steps to the new machine, consolidating work previously done on several different etchers, whilst the flexibility and ease of use have allowed us to develop our research in new directions," said Dr Alex Robinson, heading the research at the Nanoscale Physics Research Laboratory.

Mark Vosloo, OIPT’s sales director, added: “As a company we are committed to constant product innovation in order to offer our customers the latest process techniques and systems in etch, deposition and growth. NGP80 has been developed to allow faster throughput, and greater repeatability at a reduced cost to the customer. With such successful trials at Birmingham university now complete, we are confident that our customers will find the PlasmaPro NGP80, Next Generation Plasma tool is living up to its name.”

See: Oxford Instruments Company Profile

Search: OIPT RIE PECVD ICP RIE/PE

Visit: www.oxford-instruments.com