News

3 September 2009

 

Oxford Instruments launches Nanofab800Agile for nanostructure growth

Etch and deposition equipment maker Oxford Instruments Plasma Technology (OIPT) has extended its Nanofab range of flexible tools and processes, which deliver catalyst treatment and controllable growth of nanotubes and nanowires, as well as delivering standard & high-temperature plasma-enhanced chemical vapor deposition (PECVD).

The firm says that its new Nanofab800Agile system provides development opportunities to influence the growth of nanostructures. With a temperature of up to 800ºC, and agile heating and cooling for rapid turnaround, the system also delivers control of nanostructure alignment and dimensions.

Additional benefits include variable sample sizes (up to 200mm wafers, maximum), excellent temperature uniformity, and agile temperature control, the firm claims. The system is also configured with a vacuum load-lock to ensure process repeatability and chamber cleanliness.

Featuring an optional liquid source delivery system, and with custom-developed setup for aligned growth and control of film stress, the Nanofab800Agile has the ability to process in high-pressure and high-flow regimes.

“This latest addition to our range means our customers will benefit from advanced features, such as rapid heating and cooling cycles, excellent temperature uniformity and process control,” says senior product manager Ian McKinlay. “This is backed up by OIPT’s extensive process library and applications expertise,” he adds.

See: Oxford Instruments Company Profile

Search: Oxford Instruments PECVD

Visit: www.oxford-instruments.com