News

22 September 2009

 

CIP launches monolithically integrated reflective SOA-EAM for DWDM

At the 35th European Conference and Exhibition on Optical Communication (ECOC 2009) in Vienna, Austria, CIP Technologies of Martlesham Heath, UK (which manufactures photonic hybrid integrated circuits and indium phosphide-based optoelectronic chips, devices, arrays and modules) has launched the R-SOA-EAM-1550, which monolithically integrates a semiconductor optical amplifier with a reflective electro-absorption modulator to combine high optical gain with high-speed modulation capability.

CIP says that the R-SOA-EAM-1550 offers high output power, low power consumption, and low sensitivity to input polarization, making it suitable for dense wavelength division multiplexing (DWDM) transmission at speeds of 10Gb/s over fiber-optic links of up to 80km. The device is ‘colorless’, and a single device may be used across the entire C-band.

Picture (above): CIP’s R-SOA-EAM-1550.

“Using colorless modulators with remote DWDM light sources is becoming a viable alternative to expensive tunable lasers in WDM-PON [passive optical network] and metro applications,” says chief technology officer David Smith. “This level of device performance represents a breakthrough that will simplify and cost-reduce future deployments,” he reckons.

The R-SOA-EAM-1550 also incorporates standardized design features to make it compatible with the CIP HyBoard photonic integration platform. “This new device is an important addition to the toolkit of optical devices that will be integrated in the future,” says Smith.

Picture (above): Monolithic chip inside CIP’s R-SOA-EAM-1550.

In session 8.6 of the ECOC conference on Wednesday 23 September, optical systems manager Dr Alistair Poustie is presenting a paper related to the new product.

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Visit: www.ciphotonics.com