News

4 March 2009

 

DynTest partners with Teltec Pacific on Southeast Asia and China sales & service

DynTest Technologies GmbH of Grassau, Germany, which makes scribe & break wafer-to-chip singulation systems for substrates used in opto- and microelectronic component manufacturing, is expanding its activities to Southeast Asia and China by partnering with distributor Teltec Semiconductor Pacific Ltd.

DynTest says that, with specific features for III-V wafers, its product family offers extended process flexibility, automation and traceability to separate brittle materials with enhanced yield and high throughput. In addition to systems, it also provides a dedicated range of consumables for scribing and breaking.

“With Teltec Pacific we have a strong partner and experienced technical sales and service organisation covering Asia Pacific to support our customers in the People Republic of China,” says DynTest’s managing director Helge Luesebrink.

“Teltec Pacific has over 23 years’ extensive technical sales & service experience in the semiconductor, photonics, LED and solar cell industries in the Southeast Asia regions,” says Teltec Pacific’s general manager Judy Chang. “The DynTest equipment and technologies complements our existing product portfolio perfectly,” she adds. “We are ready to support the customers with a solution for higher-throughput and better quality on wafer dicing by using DynTest’s high-quality scribers and breakers.”

See related item:

JPSA and DynTest co-developing wafer scribing/breaking

Search: DynTest

Visit: www.dyntest.de

Visit: www.teltec.biz