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8 June 2009

 

StratEdge launches surface-mount package for VSAT, point-to-point, point-to-multipoint and WiMax applications up to 30GHz

At this week’s International Microwave Symposium (IMS 2009) in Boston, StratEdge of San Diego, CA, USA, which designs and produces packages for microwave, millimeter-wave, and high-speed digital devices, is launching its new high-frequency (DC-30GHz) SMX Series surface-mount package for applications such as test & measurement, VSAT, point-to-point, point-to-multipoint and WiMax.

The SMX 580495 is designed to provide good electrical transition performance for die up through the Ka-band frequency range. Transition loss is expected to be less than 0.5dB for frequencies up to 30GHz. The packages are made to provide wideband electrical performance and incorporate copper composite bases for enhanced thermal dissipation. StratEdge says that these are true surface-mount packages that allow automated assembly and soldering for high-volume production of devices without sacrificing electrical and thermal performance. They are sealed with cup-shaped liquid crystal polymer lids with B-stage epoxy preforms or can be provided in conventionally hermetic configurations for military and aerospace applications.

The 580495 is a 10-lead design with six RF and four DC pins. The package incorporates a copper-composite base and Fe-Ni-Co leadframe attached to an alumina ceramic ring frame. The base is 0.278 inches x 0.315 inches and the cavity is 0.220 inches x 0.205 inches. “Our new SMX package is the first of its kind – a completely hermetic, surface-mount solution for 30GHz applications,” claims president & CEO Tim Going. The 580495 will be offered as a standard design, with samples and volume production quantities available in Q3/2009.

The SMX Series features surface-mount packages in various sizes and lead counts. With leads and base co-planar, SMX packages are designed for mounting directly on the circuit board, greatly reducing circuit board assembly costs. Surface-mount packages also simplify the board layout and can significantly reduce board design costs, adds StratEdge.

See related items:

StratEdge introduces BeO package for GaN, SiC, and GaAs devices

StratEdge launches X-band high-power amplifiers in surface-mount packages

Search: StratEdge Surface-mount package

Visit: www.stratedge.com