News

10 July 2009

 

Nextreme raises $8m in Series B corporate funding

Nextreme Thermal Solutions of Durham, NC, USA, which designs and manufactures microscale thermal and power management products, has raised $8m in additional Series B financing from undisclosed corporate investors, bringing Series B to more than $21m and total financing since its inception in 2004 to $35m. The new funding will be used to expand Nextreme’s presence and products for energy harvesting for micro and portable power along with solidifying its position for thermal management products in computing, consumer and mobile markets.

Nextreme offers microscale cooling and thermal energy harvesting solutions (based on thin-film thermoelectric material) that integrate directly into electronic and consumer product packaging by using the widely accepted copper pillar bumping process. The firm says that its scalable cooling and power generation solutions can impact mainstream industries such as automotive, computing, consumer, mobile, and telecommunications. Applications include CPU/GPU hot spot cooling, power MOSFET cooling, LED cooling, laser diode cooling, thermal energy scavenging, thermal control in consumer products, power harvesting for sensors, and process control.

While increased functionality in a smaller footprint has been a constant driver in electronics and consumer products throughout the past 30 years, the need for improved energy efficiency and micro-scale, distributed power generation capability has emerged as a driver in many applications. These trends have translated into significant thermal and power problems in a host of industries, says Nextreme. The firm claims that it offers one of the few fundamentally new innovations addressing both thermal management and power generation in a fully scalable approach. Its technology is driven by form factor, device performance and cost, all of which are expected to drive adoption of the technology and fuel the firm's growth.

“This funding from corporate investors represents a very significant validation of our company and technology, especially during these challenging times,” comments CEO Jesko von Windheim. “With our Series B financing now fully in place, the company is well positioned to execute its product development and sales plan over the next two years.”

See related item:

Nextreme’s OptoCooler HV14 breaks temperature barrier

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