News

5 February 2009

 

Microsemi claims smallest WiFi PA

Microsemi Corp of Irvine, CA, USA, which designs and manufactures analog and mixed-signal ICs and high-reliability semiconductors, has launched what it claims is the world’s smallest wireless LAN power amplifier (PA).

With all circuitry packaged in an RoHS-compliant ultra-compact, 2mm x 2mm x 0.45mm 12-lead MLP, the LX5516 (which uses InGaP HBT technology) features integrated 50 Ohm input and output matching circuits, eliminating the external passive components and additional design work typically required to optimally tune the transmit section of an 802.11/b/g/n design. Also included is a temperature-compensated on-chip output power detector with a wide dynamic range. Output power is about 18dBm for 3% error vector magnitude (EVM). Power gain is 30dB for orthogonal frequency division multiplexing modulation (OFDM).

“By simplifying their design complexity in our ultra-compact package, we enable designers to dramatically cut product size, bill of materials cost, and time to market,” says Kang Hee Kim, RF product line manager at Microsemi’s Analog Mixed Signal Group.

The LX5516 supports IEEE 802.11b/g/n WLAN applications in the 2.4-2.5GHz frequency range, and further extends the firm's portfolio of WiFi and 802.16e WiMAX and WiBro PAs, which are used in applications including wireless access points and half mini-cards for notebooks and netbooks. “The LX5516 is ideal for OEMs and module manufacturers designing portable and mobile devices with challenging size constraints,” says Kim.

Pricing is $0.55 in 10,000-unit quantities.

See related items:

Microsemi’s SiC RF power devices for VHF and UHF radar win award

Microsemi delivers 4G wireless PA with 23% power-conversion efficiency

Search: Microsemi WLAN PA WiFi InGaP HBT

Visit: www.microsemi.com