News

30 December 2009

 

SemiLEDs’ customers confirm new I-core LED achieves over 120lm/W

LED chip maker SemiLEDs Corp of Boise, ID, USA (which has fabrication facilities in Hsinchu Science Park, Taiwan) says that its new I-core LED chip (launched in early November) has achieved luminous efficacy of more than 120lm/W in mass production in optimized white light packages of both Nationstar Optoelectronics and SENGLED (LED packaging firms based in mainland China).

The tests performed by Nationstar Optoelectronics and SENGLED were performed with a SemiLEDs 45mil I-core LED chip (available in mass production, along with the 40mil I-core LED) operated at a drive current of 350mA in a 1W package. Both firms now plan to ramp capacity for street-light applications, says SemiLEDs.

SemiLEDs says that the tests results for the I-core prove the advantages delivered through its chip technology. The firm's patented and proprietary ‘metal vertical photon’ MvpLED chip technology features a vertical structure with a copper alloy base that provides greater thermal and electrical conduction, it is claimed.

In particular, the I-core is designed with new electrodes that are convenient for wire bonding. SemiLEDs says that advantages include improved reliability, delivered through the optimization of stress management for the chip at high-current operation. The firm claims that the IC LED is also significantly brighter, as its robust design results in much improved light extraction.

The I-core LED is available in SemiLEDs’ ultra-high-brightness chip portfolio in blue (white) color, in both 40mil and 45mil chip sizes.

See related items:

SemiLEDs launches I-core LED chips

SemiLEDs adds capacity to meet demand for high-end lighting applications

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