News

17 September 2008

 

Tegal completes acquisition of AMMS’ DRIE and PECVD product lines

Plasma etch and deposition system maker Tegal Corp of Petaluma, CA, USA has completed the acquisition (announced on 2 September) from Alcatel Micro Machining Systems (AMMS) and parent company Alcatel-Lucent of their deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products and the related intellectual property, directed at advanced 3D wafer-level packaging applications. Tegal has paid $1m in cash and issued 1,044,386 shares of Tegal common stock (worth just under $4m at the current share price of $3.80).

AMMS president Gilbert Bellini is being appointed to Tegal’s board of directors to ensure the smooth transition of the AMMS business to Tegal in the near-term and to help guide Tegal into the rapidly expanding markets for 3D wafer-level packaging applications.

“These products, along with our current etch and deposition technologies, will form the basis for a comprehensive strategy to aggressively pursue a large, high-growth market in MEMS [micro-electro-mechanical systems] and semiconductor device manufacturing," says chairman, president & CEO Thomas Mika.

AMMS' installed base of DRIE tools in use by MEMS and integrated device manufacturers will continue to be supported. Tegal will continue the development of the AMMS DRIE product line, including integration of the AMMS process modules on its recently introduced Compact bridge platform and the completion of a 300mm process chamber. Tegal is also assuming responsibility for AMMS’ joint development programs.

See related items:

Tegal to acquire AMMS’ DRIE and PECVD product lines for $5m

Tegal’s sales hit by project postponements and cancellations

Tegal reports third consecutive quarter of profitability

Search: Tegal Plasma etch PECVD DRIE

Visit: www.tegal.com

Visit: www.alcatelmicromachining.com