News

29 October 2008

 

STS and SUSS MicroTec on the road in Asia

Surface Technology Systems (STS) of Newport, Wales, UK and SUSS MicroTec of Garching, Germany are to host an advanced technology roadshow in five Asian cities from October 29 to November 7. The series of one-day events will offer a comprehensive overview of the latest developments in 3D Integration and Advanced Packaging, say the firms.

Invited speakers from companies such as Panasonic, IBM and Fraunhofer IZM will discuss the optimization of integrated process solutions with respect to performance and cost. Topics cover applications such as plasma-dicing, metal-to-metal wafer-level bonding, electrostatic carriers for thin wafer handling, and thin chip integration.

SUSS MicroTec with STS and their parent company Sumitomo Precision Products Co Ltd (SPP) will demonstrate total process solutions for 3D wafer level packaging by combining the expertise of STS and SPP in deep reactive ion etch (DRIE) for via fabrication and SUSS MicroTec in photolithography and wafer bonding.

Roadshow venues and dates:

• Tokyo, Japan: October 29
• Shanghai, China: October 31
• Seoul, South Korea: November 3
• Hsinchu, Taiwan: November 5
• Singapore: November 7

Further information: www.suss.com/roadshow

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