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Telecom laser chip and module maker 3S Photonics of Nozay, France has concluded a cash investment in Coset of Gwangju City, Korea (a global provider of packaging services for optoelectronic components), as well as a development collaboration agreement between the two firms. The strategic alliance was signed in Gwangju in the presence of city mayor Gwangtae Park and other officials in charge of Gwangju’s photonic cluster.

3S has already been partnering with Coset for more than two years on packaging of its next-generation 980nm terrestrial pump laser modules (introduced this year). 3S’ VP of sales, Michel Privat, has been invited to sit on Coset’s board of directors to coordinate future collaborations.

Coset will use proceeds of the equity investment to strengthen its R&D capabilities for developing 3S’s future products as well as ramping up capacity to meet increased packaging demand.

“This equity participation fits strategically with our medium- and long-term plan to renew and diversify our product portfolio to enter into new markets concerning the defense, industrial laser and medical sectors (with latest-generation lasers for bio-instrumentation), while consolidating our position in our core business,” says 3S’ chairman and CEO Alexandre Krivine. “Obvious synergies among the two companies will lead to faster development of next-generation products as well as strengthening our footprint in Asia,” he adds.

“Coset’s renowned and complementary packaging know-how and capabilities, combined with our unparalleled expertise in the design of GaAs and InP chips, optical discrete modules and fiber Bragg grating (FBG)-based components, will help us to provide both innovative and cost-effective products to our current customer base as well as address the new markets that 3S Photonics is targeting,” says 3S’ VP of marketing Yannick Bailly.

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3S enters terrestrial pump laser module market

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